Polyurethanes reach new heights in manufacturing
applications
An offshoot of existing RIM molding
technology, a new reaction-assisted molding process (RAMP) is
being used to encapsulate electronics into smart cards without
requiring the traditional layering manufacturing process.
As reaction injection molding
(RIM) applications continue to expand worldwide, so do the possible
applications for the use of polyurethanes in the manufacturing
process.
Billed as “limited only
by the imagination” RIM techniques are already being used
to manufacture molded parts for everything from auto dashboards
and steering wheels, to ice chests and sporting goods. Recently,
however, a new technique that borrows heavily from RIM industry
has emerged. Known as the reaction assisted molding process (RAMP)
and based on low pressure and low temperature dispensing of polyurethanes
(unlike RIM which is based on high pressure and temperature),
the new technique was recently developed and patented by CardXX
of Englewood, Colorado.
CardXX is currently utilizing
its proprietary RAMP technique to securely integrate a radio frequency
identification chip and antennae, an integrated circuit, and other
electronic components including batteries into a small form factor
smart card, key fob, smart tag, memory cards and other portable
electronic devices.
The RAMP technique precisely
positions computer chips and electronic components within a mold
between two sheets of PVC or polycarbonate film, after which a
polyurethane mixture is injected at low temperature and low pressure
to completely immerse the electronic element. The electronic element
is securely encapsulated and protected when curing is completed
in less then an hour.
The development of the RAMP process
depended on locating the proper equipment. For this, CardXX utilized
existing reaction injection molding techniques, along with customizable
dispensing equipment from Gusmer Decker to accurately dispense
the minute quantities of urethane required in most RAMP applications.
Gusmer Decker, a leader in the
reaction injection molding equipment market, develops metering
machines and mixing heads for processing multi-component polyurethane
and hybrid urethane chemicals. Gusmer Decker’s RimCell Select
Series metering and dispensing units are particularly suited for
RAMP applications because of their precise mixing heads that yield
flow-rates as low as 0.33 lb. per minute—necessary to avoid
disrupting the careful placement of electronic components within
smart cards.
Gusmer Decker’s RIM molding
system allows a wide variety of shot sizes and fast cycle times
while assuring metering accuracy within strict tolerances. Such
RIM technology helps polyurethane-product manufacturers avoid
waste from overfilling parts. The ability to provide low-temperature
delivery, also necessary for RAMP applications, enables high production
volumes because of minimized cycle time.
“Smart cards have very
precise dimensional requirements,” says Reed. “Delivering
the correct quantity of thermoset polymer to the mold is absolutely
critical for meeting rigorous form factor requirements and for
achieving proper protective encapsulation of the very delicate
electronics. Our RIM equipment keeps us within tolerances and
keeps our scrappage from going through the roof.”
RAMP technology is flexible enough
to be used with PVC, Polycarbonate, Teslin™ (i.e. synthetic
paper), and a wide range of other materials for specific properties
and applications.
CardXX is now offering its patented
RAMP technology through licensing agreement. The reaction injection
molding equipment required by RAMP will be provided by CardXX
and Gusmer | Decker. |